Category :Abatement systems,
Abatement of semiconductor process exhaust stream using high-temperature plasma. | GWG (CF4, SF6, NF3, etc.) | Corrosive gas (Cl2, F2, BCl3, HBr, etc.) | Flammable gas (SiH4, TEOS, DCS, H2, etc.) | Extended lifetime of consumable parts (cathode and anode) lowers the cost of ownership. | Matching plasma power supply increases efficiency and reduces power consumption. | Energy Saving Mode feature conserves utility | Self-cleaning reactor design extends PM interval | System core & module swap maintenance capability reduces PM duration.
Abatement of semiconductor process exhaust stream using high-temperature plasma. | GWG (CF4, SF6, NF3, etc.) | Corrosive gas (Cl2, F2, BCl3, HBr, etc.) | Flammable gas (SiH4, TEOS, DCS, H2, etc.) | Extended lifetime of consumable parts (cathode and anode) lowers the cost of ownership. | Matching plasma power supply increases efficiency and reduces power consumption. | Energy Saving Mode feature conserves utility | Self-cleaning reactor design extends PM interval | System core & module swap maintenance capability reduces PM duration.
